NDLI: Embedded component substrates moving forward

Content Provider	IEEE Xplore Digital Library
Author	Appelt, B.K. Su, B. Lee, D. Yen, U. Hung, M.
Copyright Year	2011
Description	Author affiliation: Nantze Export Zone, Kaohsiung, Taiwan (Lee, D.; Hung, M.) \|\| ASE Group Inc., 1255 E Arques Ave, Sunnyvale, CA 94085, USA (Appelt, B.K.) \|\| Chung-Li, Taiwan (Su, B.; Yen, U.)
Abstract	Embedded die substrates (EDS) and embedded passives substrates (EPS) have been developed and promoted for many years already but still have to find their way into the market place. The adoption has been slow for several reasons: lack of a business model, design soft ware, test strategy and capability, standards and substrate yield. Printed wiring boards (PWB) have long adopted passives in their applications but they are typically formed passives i.e. capacitors, resistors and inductors formed during the board manufacturing process employing adapted materials to provide higher dielectric constants (Dk) or resistive values (☐). Substrates are significantly smaller in area than PWBs and the materials still have rather low Dk/? values. Further the manufacturing processes involved do not afford tight tolerance values. Hence, substrates favor the use of discretes and known good (KGD) flip chip dies (FC). It seems that nearly every substrate manufacturer has developed they own methodology and employed their specific material set to develop this technology which circumvents standardization in the near term. A large volume adaptor will be required to drive standardization either thru a standards organization or de-facto thru large volume sourced from several suppliers. The yield situation of substrates can be addressed by design i.e. employ less aggressive designs which result in higher yields and avoid the costly scrap of KGDs. Of course substrate suppliers are not accustomed to handling die (die banks, electrostatic protection, thin die or small discrete handling, etc.) ASE is well positioned to deal with these issues being a substrate manufacturer as well as the largest assembly subcon.
Starting Page	558
Ending Page	561
File Size	948035
Page Count	4
File Format	PDF
ISBN	9781457719837
e-ISBN	9781457719820
e-ISBN	9781457719813
DOI	10.1109/EPTC.2011.6184483
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-12-07
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Substrates Copper Lasers Assembly Resins
Content Type	Text
Resource Type	Article

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