NDLI: Finite Element Modelling (FEM) of Green Electronics in Aeronautical and Military Communication Systems (GEAMCOS)

Content Provider	IEEE Xplore Digital Library
Author	Chaillot, A. Massiot, G. Munier, C. Lombaert-Valot, I. Bousquet, S. Chastanet, C. Plouseau, D. Munier, E. Maron, D. Raynal, P. Villard, S. Dumonteil, R.
Copyright Year	2007
Description	Author affiliation: EADS France, Suresnes (Chaillot, A.; Massiot, G.; Munier, C.; Lombaert-Valot, I.)
Abstract	As part of the European LIFE project GEAMCOS, this paper presents the simulation evaluation of lead-free electronic assemblies submitted to harsh environments encountered in aeronautical and military communication applications. It addresses the following questions: (1) the determination of an optimal accelerated test condition in the temperature range of -40degC/100degC for assemblies with SnAgCu alloy, (2) the evaluation of the life-time of five assemblies with SnAgCu and SnPb, (3) a sensitivity analysis on design and serigraphy parameter variations, (4) the determination of a test protocol in vibration environments. All the results give relevant life-time predictions. The CSP and PQFP components should have longer time-to- failure with SnAgCu solder joints than with SnPb joints. The contrary is expected for $1^{st}$ and $2^{nd}$ level interconnects of large BGA packages. In any case, the factor is found to remain less than about 2. The PCB thermal expansion coefficient has the highest impact, followed by the solder joint height. The first level interconnect reliability is not impacted by any of the parameter changes. Simulation work in GEAMCOS project shall go on in 2007-2008 with an experimental validation of the thermo- mechanical simulations. This will require to identify a new constitutive material model for SnAgCu and to calibrate the simulations with experimental test results.
Starting Page	1
Ending Page	8
File Size	1007385
Page Count	8
File Format	PDF
ISBN	142441105X
DOI	10.1109/ESIME.2007.359936
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-04-16
Publisher Place	UK
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Finite element methods Military communication Assembly Life testing Soldering Environmentally friendly manufacturing techniques Lead Life estimation Temperature distribution Temperature sensors
Content Type	Text
Resource Type	Article

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Durability modelling of a BGA component under random vibration

Creep Analysis of a Lead-free Surface Mount Device

Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly

Assessment of LF solder joint reliability by four point cyclic bending

Vibration reliability of SMD Pb-free solder joints

Rework and reliability of QFP and BGA lead-free assemblies

Drop impact life model development for FBGA assembly with lead-free solder joint

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Finite Element Modelling (FEM) of Green Electronics in Aeronautical and Military Communication Systems (GEAMCOS)

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