NDLI: Validation of Dynamic Thermal Simulations of Power Assemblies Using a Thermal Test Chip

Content Provider	IEEE Xplore Digital Library
Author	Jorda, X. Vellvehi, M. Perpinya, X. Galvez, J.L. Godignon, P.
Copyright Year	2007
Description	Author affiliation: Centre Nac. de Microelectron. CNM, CSIC, Cerdanyola del Valles (Jorda, X.; Vellvehi, M.; Perpinya, X.; Galvez, J.L.; Godignon, P.)
Abstract	Thermal simulation is the main thermal design tool used to predict temperature distributions of complex power electronics assemblies. Nevertheless, the validation of the simulation results remains a complex problem, mainly in dynamic operation, due to the difficulty in measuring semiconductor device temperatures. This paper proposes a methodology for the accurate validation of CFD 3-D thermal simulations of power modules. A test power assembly structure based on two thermal test chips and an insulated metal substrate, has been measured with single power pulse excitations. The corresponding thermal simulations have been performed to reproduce the experimental conditions, close to the real operational ones. A very good agreement between simulation and experience has been obtained. Fine adjustment and analysis of some critical parameters (thermal conductivities, etc.) is possible using this approach.
Starting Page	1
Ending Page	6
File Size	8147310
Page Count	6
File Format	PDF
ISBN	142441105X
DOI	10.1109/ESIME.2007.360016
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-04-16
Publisher Place	UK
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Testing Semiconductor device measurement Pulse measurements Thermal conductivity Predictive models Temperature distribution Power electronics Temperature measurement Semiconductor devices
Content Type	Text
Resource Type	Article

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