NDLI: Transport of Corrosive Constituents in Epoxy Moulding Compounds

Content Provider	IEEE Xplore Digital Library
Author	van Soestbergen, M. Ernst, L.J. Zhang, G.Q. Rongen, R.T.H.
Copyright Year	2007
Description	Author affiliation: Netherlands Inst. for Metals Res., Delft (van Soestbergen, M.)
Abstract	Epoxy moulding compounds are the leading encapsulating material in today's microelectronic packaging industry. These compounds are hydrophilic and absorb moisture when exposed to humid environments. As a result of the absorbed moisture, ions in the material will become more mobile. This, in combination with high electrical field strengths due to the continuously decreasing feature sizes of ICs, will result in a large flux of ions toward charged interfaces, such as aluminium bond pads. Hence, ion-related failure mechanisms, such as corrosion, might become more prominent. In this paper a method for obtaining the diffusion coefficients of the different ions at elevated temperatures in saturated moulding compounds is reported. This method is based on determining the total ionic content by ion chromatography after immersing a presaturated sample in a water bath containing the ions and fitting the data to a Fickian diffusion model. The measured diffusion coefficients of NaCl in a commercially available moulding compound at 30degC and 60degC are 2.9 x $10^{13}$ $m^{2}/s$ and 9.5 x $10^{13}$ $m^{2}/s,$ respectively. These coefficients are used to compare experimental data for bond pad corrosion as function of humidity, time and bias with a multi-physics finite element model.
Starting Page	1
Ending Page	5
File Size	5973009
Page Count	5
File Format	PDF
ISBN	142441105X
DOI	10.1109/ESIME.2007.360019
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-04-16
Publisher Place	UK
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Moisture Bonding Corrosion Lead compounds Microelectronics Packaging Aluminum Failure analysis Temperature Humidity
Content Type	Text
Resource Type	Article

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