NDLI: A coupled numerical and experimental study on thermo-mechanical fatigue failure in SnAgCu solder joints

Content Provider	IEEE Xplore Digital Library
Author	Erinc, M. Schreurs, P.J.G. Geers, M.G.D.
Copyright Year	2007
Description	Author affiliation: Mater. Technol., Univ. of Technol., Eindhoven (Erinc, M.; Schreurs, P.J.G.; Geers, M.G.D.)
Abstract	In ball grid array (BGA) packages, solder balls are exposed to cyclic thermo-mechanical strains arising from the thermal mismatch between package components. Since fatigue cracks in solder balls are observed generally at the chip side junction, dedicated fatigue experiments are conducted using eutectic SnAgCu- Ni/Au specimens in order to mechanically characterize the bonding interface. Sn based solders are prone to thermal fatigue due to the intrinsic thermal anisotropy of the beta-Sn phase. Bulk SnAgCu specimens are thermally cycled and mechanical tests are conducted to quantify the thermal fatigue damage. In both damage schemes a strong size effect is observed. Experimental results are used to develop a cohesive zone based fatigue damage evolution law. Fatigue crack propagation is predicted by an irreversible linear traction-separation cohesive zone law accompanied by a non-linear damage variable. Finally, bulk damage in SnAgCu due to thermal fatigue and the interfacial fatigue failure in BGA balls are combined to simulate a BGA solder ball exposed to thermo- mechanical fatigue in 2D. This combined approach gives a more realistic outcome when determining the overall mechanical response, since the microstructural entities and the solder ball itself are on the same size scale and thus the solder ball cannot be treated as a continuum.
Starting Page	1
Ending Page	6
File Size	6902266
Page Count	6
File Format	PDF
ISBN	142441105X
DOI	10.1109/ESIME.2007.359928
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-04-16
Publisher Place	UK
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermomechanical processes Fatigue Soldering Thermal conductivity Electronics packaging Capacitive sensors Gold Bonding Tin Anisotropic magnetoresistance
Content Type	Text
Resource Type	Article

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