NDLI: Experimental Determination of Time-Independent Elastic-Plastic Behaviour of Solder Joints at High Strain Rates

Content Provider	IEEE Xplore Digital Library
Author	Wiese, S. Meier, K. Scholz, D. Muller, A. Rollig, M. Rzepka, S. Wolter, K.-J.
Copyright Year	2007
Description	Author affiliation: Electron. Packaging Lab., Dresden Univ. of Technol., Dresden (Wiese, S.; Meier, K.)
Abstract	In order to investigate the time-independent behaviour of solder joints at high strain rates, a test setup was created capable of measuring the force vs. time reaction of small solder joint in shear loading at strain rates between 10 $^{-1}$ - $10^{4}$ [1/s]. The paper describes the design of this high strain rate tester. Details providing for the fast and high resolution force measurement are given. The results of analytic and FEM analyses applied to optimize the force sensor are presented. The paper also points out the challenges of high strain rate measurements of small solder joints. The validation tests applied alumina chips with five SnAgCu solder joints, which had barrel shape with about 200 mum diameter and stand-off height. The test results show good reproducibility of the force vs. time reactions. They match the benchmark results obtained at moderate shear speeds with existing equipment. In addition, fractographic analysis clearly found the two failure modes, bulk and brittle, that had been expected. Hence, the new test setup seems well suited for the tasks it has been designed for.
Starting Page	1
Ending Page	5
File Size	4408735
Page Count	5
File Format	PDF
ISBN	142441105X
DOI	10.1109/ESIME.2007.360052
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-04-16
Publisher Place	UK
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Capacitive sensors Strain measurement Force measurement Force sensors Semiconductor device measurement Shape Reproducibility of results Benchmark testing Failure analysis
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in