NDLI: Thermal-mechanical Modelling of Power Electronic Module Packaging

Content Provider	IEEE Xplore Digital Library
Author	Hua Lu Tilford, T. Xiangdong Xue Bailey, C.
Copyright Year	2007
Description	Author affiliation: Sch. of Comput. & Math. Sci., Univ. of Greenwich, London (Hua Lu; Tilford, T.; Xiangdong Xue; Bailey, C.)
Abstract	In this paper the reliability of the isolation substrate and chip mountdown solder interconnect of power modules under thermal-mechanical loading has been analysed using a numerical modelling approach. The damage indicators such as the peel stress and the accumulated plastic work density in solder interconnect are calculated for a range of geometrical design parameters, and the effects of these parameters on the reliability are studied by using a combination of the finite element analysis (FEA) method and optimisation techniques. The sensitivities of the reliability of the isolation substrate and solder interconnect to the changes of the design parameters are obtained and optimal designs are studied using response surface approximation and gradient optimization method.
Starting Page	1
Ending Page	6
File Size	6525922
Page Count	6
File Format	PDF
ISBN	142441105X
DOI	10.1109/ESIME.2007.359960
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-04-16
Publisher Place	UK
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronic packaging thermal management Power electronics Multichip modules Thermal loading Numerical models Thermal stresses Plastics Finite element methods Design optimization Response surface methodology
Content Type	Text
Resource Type	Article

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