NDLI: The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties

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The Effect of Downscaling the Dimensions of Solder Interconnects on their Creep Properties

Content Provider	IEEE Xplore Digital Library
Author	Wiese, S. Roellig, M. Mueller, M. Wolter, K.-J.
Copyright Year	2007
Description	Author affiliation: Electron. Packaging Lab., Dresden Univ. of Technol., Dresden (Wiese, S.)
Abstract	The creep behaviour of solders is an important input for accurate material models for FE-analysis of electronic assemblies. Usually the mechanical behaviour of solders, is been determined by tensile tests on bulk solder specimens. Although performing these tests is not complicated and the results are easy to interpret, one of the key problems lies in the fact that solder joints are very small and therefore cannot be represented by large tensile specimens. The paper describes the attempts to gain deformation data on ultra small solder joints. It compares creep data that was experimentally gained on bulky samples and on small solder joints.
Starting Page	1
Ending Page	8
File Size	4866266
Page Count	8
File Format	PDF
ISBN	142441105X
DOI	10.1109/ESIME.2007.359952
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-04-16
Publisher Place	UK
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Creep Soldering Electronics packaging Assembly Materials testing Force measurement Electronic packaging thermal management Manufacturing processes Reliability theory Failure analysis
Content Type	Text
Resource Type	Article

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