NDLI: A modified inductively coupled plasma for high-speed, ultra-smooth reactive phase etching of silica glass

Content Provider	IEEE Xplore Digital Library
Author	Zhang, C. Hatipoglu, G. Tadigadapa, S.
Copyright Year	2015
Description	Author affiliation: Dept. of Electr. Eng., Pennsylvania State Univ., State College, PA, USA (Zhang, C.; Hatipoglu, G.; Tadigadapa, S.)
Abstract	We report on the etching of borosilicate glass substrates in a conventional and modified inductively coupled plasma - reactive ion etch (ICP-RIE) tool. We present the etch rates and surface roughness of borosilicate glass in various fluorine based plasmas using $C_{4}F_{8},$ $SF_{6},$ Ar, $NF_{3},$ and $H_{2}O$ gases. In the conventional ICP-RIE etching mode an etch rate of 0.55 μm/min at a rms surface roughness of 25 nm was obtained at $C_{4}F_{8},$ $SF_{6}$ flow rates of 5 sccm, $O_{2}$ flow rate of 50 sccm, 2000 W of ICP power, 475 W of substrate power. A maximum etch rate of 0.67μm/min was obtained at a high rms surface roughness of 450 nm by increasing flow rate of $C_{4}F_{8}$ to 50 sccm. Using the modified ICP-RIE system consisting of a gas diffuser ring clamped to the substrate holder, the physical component of the etching was considerably reduced and we have been able to achieve etch rates ~0.72 μm/min with surface smoothness of ~1 nm for borosilicate glass and fused silica respectively after 5 minutes etches.
Starting Page	592
Ending Page	595
File Size	613589
Page Count	4
File Format	PDF
ISBN	9781479989553
ISSN	21641641
DOI	10.1109/TRANSDUCERS.2015.7180993
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-06-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Gases Sulfur hexafluoride Plasmas Microwave FET integrated circuits Microwave integrated circuits Microfabrication Water glass etching mechanism Modified ICP-RIE fused silica borosilicate glass plasma etching inductively coupled plasma
Content Type	Text
Resource Type	Article

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