NDLI: Low stress flip-chip package for pressure sensors operating at 500 °C

Content Provider	IEEE Xplore Digital Library
Author	Zeiser, R. Ayub, S. Wagner, P. Muller, J. Henneck, S. Wilde, J.
Copyright Year	2015
Description	Author affiliation: Univ. of Ilmenau, Ilmenau, Germany (Muller, J.) \|\| Robert Bosch GmbH, Stuttgart, Germany (Henneck, S.) \|\| IMTEK, Univ. of Freiburg, Freiburg, Germany (Zeiser, R.; Ayub, S.; Wagner, P.; Wilde, J.)
Abstract	This work presents a method for a reliable assembly and interconnection of MEMS for very high temperatures. A flip-chip concept for resistive micromechanical pressure sensors with a platinum thin film was developed and sensor-assemblies were fabricated. The investigated metallized ceramic substrates were AlN, $Si_{3}N_{4},$ a Low-Temperature-Cofired-Ceramic (LTCC) and a zirconia-silicate $(ZrSiO_{4}).$ A borosilicate glass-solder was the die-attachment material and gold stud-bumps were the interconnection. The thermal-mechanical stresses in the sensors, induced by the packaging process due to material-dependent mismatches were analyzed with FEM and optical deformation measurements from 20 to 500 °C. The comparison of the obtained experimental and FE-results revealed a strong influence of the applied substrate on the thermal-mechanical stresses in the chip-membrane which is affecting the output-signal and reliability. Both methods were in good accordance. The two specific silicon-matched ceramic substrates LTCC and $ZrSiO_{4}$ reduced the stresses in the sensor-element significantly. Furthermore, the electrical characterization of assembled test-sensors revealed a correlation between the package-induced stresses in the chip-membrane and the shift of the sensor-signal after the assembly-process.
Starting Page	1271
Ending Page	1274
File Size	2261924
Page Count	4
File Format	PDF
ISBN	9781479989553
ISSN	21641641
DOI	10.1109/TRANSDUCERS.2015.7181162
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-06-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Stress Substrates Temperature sensors Assembly Temperature measurement Flip-chip devices stress analysis High temperature flip-chip ESPI-measurement finite-element-method ceramic substrates
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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