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Content Provider | IEEE Xplore Digital Library |
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Author | Jin, S. Fu, X.A. Mehregany, M. |
Copyright Year | 2009 |
Description | Author affiliation: Materials Science and Engineering, Case Western Reserve University, Cleveland, OH 44106, USA (Jin, S.) || Electrical Engineering and Computer Science, Case Western Reserve University, Cleveland, OH 44106, USA (Mehregany, M.) || Chemical Engineering, University of Louisville, KY 40292, USA (Fu, X.A.) |
Abstract | We report a thermodynamically-stable Ti/TaSi/Pt Ohmic contact on n-type, heavily-nitrogen-doped low-pressure chemical vapor deposited polycrystalline 3C-silicon carbide; this Ohmic contact metallization is suitable for stable high temperature operation. The contact shows excellent linearity and has a specific contact resistance (SCR) as low as $2×10^{−5}$ Ω-cm, directly after sequential sputtering of 100 nm of Ti, 400 nm of TaSi and 200 nm of Pt. The SCR of the metallization following a 20-mins anneal in nitrogen ambient at 600°C decreases to $3.9×10^{−6}$ Ω-cm. The contact remains Ohmic throughout 1000 hours of aging in air at 550°C. Auger electron spectroscopy has been used to analyze the metal/semiconductor interface to understand the prevailing reactions in this metal-semiconductor contact. |
Starting Page | 1083 |
Ending Page | 1086 |
File Size | 669705 |
Page Count | 4 |
File Format | |
ISBN | 9781424441907 |
e-ISBN | 9781424441938 |
DOI | 10.1109/SENSOR.2009.5285947 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2009-06-21 |
Publisher Place | USA |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Ohmic contacts Silicon carbide Metallization Thyristors Chemicals Temperature Linearity Contact resistance Sputtering Annealing platinum Ohmic contact silicon carbide titanium tantalum silicide |
Content Type | Text |
Resource Type | Article |
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