NDLI: Three dimensional surface-shape tactile imager with fingertip-size silicon integrated sensor-membran

Content Provider	IEEE Xplore Digital Library
Author	Takao, H. Yawata, M. Sawada, K. Ishida, M. Okada, H.
Copyright Year	2009
Description	Author affiliation: Dept. of Electrical and Electronic Eng., Toyohashi University of Technology, Japan (Takao, H.; Yawata, M.; Sawada, K.; Ishida, M.; Okada, H.)
Abstract	In this study, fingertip-size integrated silicon tactile sensor-membrane for three-dimensional (3D) surface-shape imaging system has been newly developed. The sensing area is 8mmφ-area and several-µm thickness silicon membrane. It is swollen like a balloon surface and strain sensor pixel is arrayed on it for detection of surface shape. The movable device structure is fabricated by CMOS compatible post micromachining with SOI wafers. Totally integrated device packaging technology was also developed for surface-shape imaging system. Experimental demonstration of real-time imaging/reading of 3D Braille surface' is presented for the first time. In this system, nearly 1µm depth resolution is realized at 1Hz-bandwidth by highly sensitive silicon sensor structure with enough robustness in use.
Starting Page	2186
Ending Page	2189
File Size	810931
Page Count	4
File Format	PDF
ISBN	9781424441907
e-ISBN	9781424441938
DOI	10.1109/SENSOR.2009.5285610
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-06-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Sensor arrays High-resolution imaging Biomembranes Capacitive sensors Shape CMOS image sensors Micromachining Packaging CMOS technology Integrated sensor Tactile sensor CMOS/MEMS Fingertip-size Surface shape imaging
Content Type	Text
Resource Type	Article

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