NDLI: Hermetic thin film encapsulation of mechanical transducers for smart label applications

Content Provider	IEEE Xplore Digital Library
Author	Reuter, D. Nowack, M. Rennau, M. Bertz, A. Wiemer, M. Kriebel, F. Gessner, T.
Copyright Year	2009
Description	Author affiliation: Fraunhofer Research Institution for Electronic Nano Systems, D 09126 Chemnitz, Germany (Wiemer, M.) \|\| Center for Microtechnologies, Chemnitz University of Technology, D 09107, Germany (Reuter, D.; Nowack, M.; Rennau, M.; Bertz, A.; Gessner, T.) \|\| KSW Microtec AG, D 01099 Dresden, Germany (Kriebel, F.)
Abstract	For realizing an active smart RFID label monitoring mechanical shock and inclination during transport processes, a capacitive inertial sensor has been developed. Hermetic sealing of the microstructures has been done by a wafer level thin film encapsulation technology based on CF-polymer as sacrificial layer material and a stress-optimized dielectric layer stack as capping material. Long term stability of the thin film encapsulation hermeticity in dependence of the material stack was tested by measuring the pressure inside the package using the pressure dependency of viscous damping between the electrode plates. For the used material stacks containing SiO) or SiO) and sputtered aluminum a sufficient hermeticity with leak rates of 2E-10 Pa·l/s and 6E-12 Pa·l/s, respectively, could be achieved.
Starting Page	208
Ending Page	211
File Size	932880
Page Count	4
File Format	PDF
ISBN	9781424441907
e-ISBN	9781424441938
DOI	10.1109/SENSOR.2009.5285526
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-06-21
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Transistors Encapsulation Transducers Dielectric materials Dielectric thin films Sealing materials Radiofrequency identification Active RFID tags Monitoring Electric shock hermeticity test wafer-level packaging thin film encapsulation CF-polymer 2f-method
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Wafer Level Thin Film Encapsulation for MEMS

Thin Filmencapsulation of microstructures using Sacrificial CF-Polymer

Robust hermetic wafer level thin-film encapsulation technology for stacked MEMS / IC package

Wafer-Level Encapsulation and Sealing of Electrostatic HARPSS Transducers

Pentacene based RFID transponder circuitry

Polymer dielectric options for thin film packaging applications

Wafer Level Thin Film Encapsulation for BAW RF MEMS

Thin-Film Encapsulated RF MEMS Switches

Capacitive Humidity Sensors on Flexible RFID Labels

Hermetic thin film encapsulation of mechanical transducers for smart label applications

Similar Documents

Wafer Level Thin Film Encapsulation for MEMS

Thin Filmencapsulation of microstructures using Sacrificial CF-Polymer

Robust hermetic wafer level thin-film encapsulation technology for stacked MEMS / IC package

Wafer-Level Encapsulation and Sealing of Electrostatic HARPSS Transducers

Pentacene based RFID transponder circuitry

Polymer dielectric options for thin film packaging applications

Wafer Level Thin Film Encapsulation for BAW RF MEMS

Thin-Film Encapsulated RF MEMS Switches

Capacitive Humidity Sensors on Flexible RFID Labels

Hermetic thin film encapsulation of mechanical transducers for smart label applications