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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Lei Zhang Xiuzhen Lu Xin Luo Carlberg, B. Zandira, M. Lilei Ye Liu, J. |
| Copyright Year | 2011 |
| Description | Author affiliation: Key Laboratory of Advanced Display and System Applications, Ministry of Education & SMIT Center, School of Mechatronics Engineering and Automation, Shanghai University, P.O.B. 282, Shanghai 200072, China (Lei Zhang; Xiuzhen Lu; Xin Luo; Liu, J.) || SHT Smart High Tech AB, Fysikgrand 3, 412 96 Gothenburg, Sweden (Lilei Ye) || SMIT Center & Bionano Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology, SE-412 96 Gothenburg, Sweden (Carlberg, B.; Zandira, M.) |
| Abstract | With the continual increase in cooling demand for microprocessors, the microelectronics industry has been increasingly focused on the development of thermal solutions. Thermal Interface Material (TIM) plays a key role in reducing the thermal resistance of packaging and the thermal resistance between the electronic device and the external cooling components. Nano-TIM, a new type of thermal interface material, was developed to improve the heat dissipation of electronic devices. This paper describes work undertaken to research the reliability of Nano-TIM. Pull tests were used to investigate the shear strength of samples with Nano-TIM of different thicknesses coalesced between two PCBs with Sn coating made under different pressure. Scanning Electron Microscopy (SEM) analysis techniques were used to determine the morphology of the shear fracture section after pull tests and observe the structure of the cross section of Nano-TIM coalesced between two PCBs with Sn coating. |
| Starting Page | 1 |
| Ending Page | 4 |
| File Size | 1033207 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781457717703 |
| e-ISBN | 9781457717697 |
| e-ISBN | 9781457717680 |
| DOI | 10.1109/ICEPT.2011.6066869 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-08-08 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Materials Electronic packaging thermal management Thermal resistance Metals Heating Reliability Thermal conductivity |
| Content Type | Text |
| Resource Type | Article |
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