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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jinglin Bi Anmin Hu Ming Li Dali Mao |
| Copyright Year | 2011 |
| Description | Author affiliation: Lab of Microelectronic Materials & Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China (Jinglin Bi; Anmin Hu; Ming Li; Dali Mao) |
| Abstract | Low cost electrodeposited Sn3.5Ag solder bumps fabrication technology was developed for three-dimensional packaging applications. Effect of reflow time on interfacial reaction of electroplated Sn3.5Ag solder bumps with Cu under-bump metallization (UBM) was investigated. The microstructure of eutectic Sn3.5Ag is composed of β-Sn phase and Ag3Sn IMCs in the solder region. At the interface between solder and Cu, scallop-like Cu-Sn IMCs were formed toward solder region and were identified as Cu6Sn5 IMCs by compositional measurement of EDX. XRD measurement identified that Cu6Sn5 and Ag3Sn formed after reflowing for lmin, and as the reflow time extended the quantity of Ag3Sn almost remained the same while the quantity of Cu6Sn5 increased. No Cu3Sn was detected, even after reflowing for 20min. EDX analysis was consistent with the XRD result. |
| Starting Page | 1 |
| Ending Page | 5 |
| File Size | 3643879 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781457717703 |
| e-ISBN | 9781457717697 |
| e-ISBN | 9781457717680 |
| DOI | 10.1109/ICEPT.2011.6066855 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-08-08 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Copper Tin Silver Metallization Microstructure Packaging X-ray scattering |
| Content Type | Text |
| Resource Type | Article |
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