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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Rui Guo Ming Li Dali Mao Weiping Li |
| Copyright Year | 2011 |
| Description | Author affiliation: Institute of Microelectronic Materials & Technology, School of Materials Science and Engineering, Shanghai Jiao Tong, University, Shanghai 200240, China (Rui Guo; Ming Li; Dali Mao) || Jiangsu Changjiang Electronics Technology Co., Ltd, 214431, China (Weiping Li) |
| Abstract | Molded interconnect system (MIS) is a new generation of substrate technology for traditional QFN, and fine gold wire bonding should be used. While lots of studies focused on the wedge bonding process, the effect of Ni/Pd/Au finish on the bonding force was never verified before. This paper will present a detailed investigation on the wedge bonding on MIS leadframe, and many aspects which affect the gold wire wedge bonding including components, morphology, and hardness were studied. The results show that the hardness of the Ni layer is found directly decides the wedge bonding force with the Ni layer increasing. It is possible to optimize the thickness of Ni/Pd/Au finish material to control the wedge bonding strength. |
| Starting Page | 1 |
| Ending Page | 5 |
| File Size | 1189731 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781457717703 |
| e-ISBN | 9781457717697 |
| e-ISBN | 9781457717680 |
| DOI | 10.1109/ICEPT.2011.6066988 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-08-08 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Wires Nickel Gold Bonding Lead Bonding forces Substrates |
| Content Type | Text |
| Resource Type | Article |
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