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Content Provider | IEEE Xplore Digital Library |
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Author | Ning Kang Mingliang Huang Qiang Zhou Haitao Ma |
Copyright Year | 2011 |
Description | Author affiliation: Electronic Packaging Materials Laboratory, School of Materials Science & Engineering, Dalian University of Technology, Dalian 116024 China (Ning Kang; Mingliang Huang; Qiang Zhou; Haitao Ma) |
Abstract | Three new Sn-Zn based lead-free solders were used to join Al and Cu in this study. Needle-like Zn phases and AgZn3 phases formed in the bulk solder of 1# and 3#, however, globular-like Zn phases were found in the micro structure of 2# bulk solder. 2# solder owned the best wettalility on the Cu substrates and Al substrates. In as-soldered joints of all the solders, the A14.2Cu3.2Zn0.7 compound layer formed at the interface of solder and Cu, while the Al-Zn-Sn solid solution zone formed at the interface of solder and Al. The AgZn3 phase was also found at the interface of 1# and 3# solder and the eutectic mixture of 2# solder had more homogeneous distribution than those of 1#, 3# and Sn-9Zn solder joints. The microstructure of 2# solder joint induced higher shear strength than those of 1#, 3# and Sn-9Zn solder joints. The corrosion potential of 1# solder was more noble than those of 2# solder and 3# solder in 3.5% NaCl solution. |
Starting Page | 1 |
Ending Page | 5 |
File Size | 2878600 |
Page Count | 5 |
File Format | |
ISBN | 9781457717703 |
e-ISBN | 9781457717697 |
e-ISBN | 9781457717680 |
DOI | 10.1109/ICEPT.2011.6066846 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2011-08-08 |
Publisher Place | China |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Copper Substrates Soldering Microstructure Joints Zinc |
Content Type | Text |
Resource Type | Article |
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