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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Xiaoya Wang Mengting Han Liming Ma Guangchen Xu Fu Guo |
| Copyright Year | 2011 |
| Description | Author affiliation: College of Materials Science and Engineering, Beijing University of Technology (Xiaoya Wang; Mengting Han; Liming Ma; Guangchen Xu; Fu Guo) |
| Abstract | Due to the excellent resistance to thermal mechanical fatigue and creep resistance properties of in-situ Cu6Sn5 reinforced composite solder, it's meaningful to further investigate the Electromigration (EM) behaviors of such novel composite solder. We used in-situ method to prepare Cu6Sn5 reinforced Sn-3.5Ag composite solders, the weight fraction of which was 1 vol.%, 5 vol.%, and 20 vol.%, respectively. A constant electric current was applied to a one-dimensional solder joint which ensures a uniform distribution of current density. For this study, a current density of 104 A/cm2 was applied to solder joints under 75°C. The evolution of interior microstructure due to current stressing effects was observed by using scanning electron microscopy (SEM). The results revealed that after current stressing for 96 and 192 h, no remarkable EM damages exhibited in solder matrix. Whereas, after current stressing for 384 h, 1 vol.% and 20 vol.% Cu6Sn5 reinforced composite solder joints have suffered different degrees of polarity effects. |
| Starting Page | 1 |
| Ending Page | 5 |
| File Size | 2970551 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781457717703 |
| e-ISBN | 9781457717697 |
| e-ISBN | 9781457717680 |
| DOI | 10.1109/ICEPT.2011.6066821 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-08-08 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Soldering Anodes Cathodes Microstructure Copper Electromigration Packaging |
| Content Type | Text |
| Resource Type | Article |
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