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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Moscicki, A. Falat, T. Kinart, A. Smolarek, A. Merten, E. |
| Copyright Year | 2014 |
| Description | Author affiliation: Amepox Microelectronics, Ltd, Poland (Moscicki, A; Kinart, A.; Smolarek, A.) || Berliner Nanotest & Design GmbH (Merten, E.) || Laboratory for Interconnecting and Packaging Electronic Circuits Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics (Falat, T.) |
| Abstract | One of the largest problems connected with actual electronic and microelectronics systems is removing of heat generated by them, particularly through the power elements. The most so far widespread technical solutions in the range of high thermally conductive layers (Thermal Interface Materials — TIM), are compositions on the base of organic adhesives including as a fillers the particle of silver in the powder or flake shapes with the reason that it is material with very high thermal conductivity (ov. 420 W/mK). The compositions of this type are mostly thermally curing or sintering. Unfortunately this solution contain organic resins, what give the big limits the final value of the thermal conductive coefficient in the large degree, and also limits the maximum range of applying materials. |
| Starting Page | 449 |
| Ending Page | 452 |
| File Size | 403329 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781479969944 |
| DOI | 10.1109/EPTC.2014.7028361 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-12-03 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Silver Thermal conductivity Materials Conductivity Nanoparticles Electronic packaging thermal management Temperature measurement |
| Content Type | Text |
| Resource Type | Article |
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