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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jibing Chen Yiping Wu Bing An |
| Copyright Year | 2011 |
| Description | Author affiliation: Wuhan National Laboratory for Optoelectronics, State Key Laboratory of Material Processing and Die & Mould Technology, Huazhong University of Science and Technology, Wuhan, 430074, China (Jibing Chen; Yiping Wu; Bing An) |
| Abstract | Lead-free solder joints in electronic packages experience the thermal cycles as the electronic packaging products encounter the temperature fluctuations. This study provides some prospectives into the microstructural changes of the solder joints interconnection by rapid thermal cycles. The influence of the different heating temperatures on the interfacial microstructure between single Sn-3.0Ag-0.5Cu (SAC) solder joints and Cu substrate was also investigated. The single solder joint was prepared by reflowing ball grid array (BGA) and then was cut separately. According to the testing temperature and time the specimen is rapidly heated and cooled by the designed experiment apparatus. The microstructures and compositions of solder joints are observed and analyzed by scanning electron microscopy (SEM). It was found that the rapid thermal cycles has a significant influence on the microstructure of single SAC lead-free solder joint. The thickness of intermetallic compound (IMC) increases gradually with the elevated heating temperature portion of rapid thermal cycles. In addition, the intermetallic compound (IMC) Cu3Sn layer is observed except for Cu6Sn5 layer, the heterogeneously coarsened region occur between the IMC and Cu substrate, the coarsening is not associated with the SAC/Cu solder interface. The strain and stress of single solder joint were affected after rapid thermal cycles as well. |
| Starting Page | 1 |
| Ending Page | 4 |
| File Size | 1305469 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781457717703 |
| e-ISBN | 9781457717697 |
| e-ISBN | 9781457717680 |
| DOI | 10.1109/ICEPT.2011.6066997 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-08-08 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Soldering Electronic packaging thermal management Fatigue Microstructure Copper Testing Materials |
| Content Type | Text |
| Resource Type | Article |
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