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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Cai-Fu Li Zhi-Quan Liu Jian-Ku Shang |
| Copyright Year | 2011 |
| Description | Author affiliation: Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China (Cai-Fu Li; Zhi-Quan Liu; Jian-Ku Shang) |
| Abstract | Traditional transmission electron microscope (TEM) specimen of CeSn3 was prepared and observed intermittently, and large amount of tin whiskers were found growing from the specimen due to the selective oxidation at room ambient. This method enables in-situ TEM study of tin whiskers without mechanical handling or focus ion beam (FIB) sampling. The growth rate of tin whisker could be more than 0.28nm/s, which was very fast than other reports. A reaction formula was proposed to summarize the oxidation of CeSn3 at ambient condition. According to the formula, the reaction resulted in Ce(OH)3 rather than reported Ce02 at our room ambient condition (temperature: 18+2°C, relative humidity: 20+5%). The released tin atoms provide the source for tin whisker growth. Meanwhile, the oxidation induced 43% volume expansion, which introduced the compressive stress as the driven force for whisker growth. Tin atoms released from selective oxidation would diffuse or add to the whisker root under the compressive stress gradient. A growth model was proposed to illustrate the whisker growth process on Ce containing lead free solders, which would help to understand the mechanism of whisker phenomenon. |
| Starting Page | 1 |
| Ending Page | 4 |
| File Size | 632424 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781457717703 |
| e-ISBN | 9781457717697 |
| e-ISBN | 9781457717680 |
| DOI | 10.1109/ICEPT.2011.6066976 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-08-08 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Tin Oxidation Compounds Compressive stress Electronics packaging Diffraction |
| Content Type | Text |
| Resource Type | Article |
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