NDLI: Solution to leakage of polyimide-structural wafer level package

Content Provider	IEEE Xplore Digital Library
Author	Dong Chen Lai, C.M. Tan, K.H. Li Zhang Xinjiang Long
Copyright Year	2011
Description	Author affiliation: Jiangyin Changdian Advanced Package Co., LTD No. 275, Binjiang Middle Road, Jiangyin, Jiangsu, China (Dong Chen; Lai, C.M.; Tan, K.H.; Li Zhang; Xinjiang Long)
Abstract	For handheld products, package size is required as small as possible, new packaging technology such as wafer level chip scale packaging (WLCSP), stacking die, 3D packaging is developed quickly. So far, wafer level packaging is realized in mass production and accepted by most of semiconductor enterprises. However, mechanical reliability is the great concern for WLCSP products usage. The primary driving force of the electrical failure is rapidly winding of circuit board due to high-accelerated strain. To improve the mechanical performance of the package, PI is introduced to buffer the stress, but PI also increases the risk of leakage aspect to electrical performance. In this paper, experiments were conducted to decrease the leakage by investigating several factors, including etching solution concentration, etching time, etching temperature and plasma. The result shows that wet etching process optimization only can decrease the leakage to 18nA, but using wet etching coupled plasma method, the leakage is dropped dramatically and as small as 0.0InA. A mode is proposed to explain the action mechanism of plasma on decreasing leakage.
Starting Page	1
Ending Page	4
File Size	1969661
Page Count	4
File Format	PDF
ISBN	9781457717703
e-ISBN	9781457717697
e-ISBN	9781457717680
DOI	10.1109/ICEPT.2011.6066810
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-08-08
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Etching Metals Semiconductor device reliability Plasma temperature Wafer level package Leakage Polyimide Titanium Wet etching plasma
Content Type	Text
Resource Type	Article

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