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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Zhong Ying Zhang Wei Wang Chunqing Wang Chunyu Li Bin |
| Copyright Year | 2011 |
| Description | Author affiliation: National Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, No.92, West Da-Zhi Street, Harbin, Heilongjiang, 150001, P. R. China (Zhong Ying; Wang Chunqing; Li Bin) || School of Material Science and Engineering, Harbin Institute of Technology(Weihai), No.2, West Wenhua Road, Weihai, Shandong, 264209 P. R. China (Zhang Wei; Wang Chunyu) |
| Abstract | With the method of copper-coating 100µm Diamonds was added into Sn3.0Ag0.5Cu(SAC305) solder to acquire Diamond/SAC305 composite solder bumps on Cu pad, which is considered to be a potential material to improve the thermal management of HB-LEDs, on account of the favorable conducting property of diamonds. Not only was a relatively high (7 wt. %) and controllable addition amount of diamonds achieved, but also a much better outlook of the solder bumps was observed. What's more, spreading areas of the new solder were calculated and shear strengths of the bumps were measured. Spreading area went up and down respectively before and after the diamond additions was 3wt%. Meanwhile the shear strength fluctuated with peaks at lwt% and 7wt%. The distribution of diamonds was observed as centralizing mainly at the interface between the solder and the Cu pad, making up a special enhanced interface character as a kind of functionally gradient (FG) solder bump. |
| Starting Page | 1 |
| Ending Page | 5 |
| File Size | 2504426 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781457717703 |
| e-ISBN | 9781457717697 |
| e-ISBN | 9781457717680 |
| DOI | 10.1109/ICEPT.2011.6066816 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-08-08 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Diamond-like carbon Copper Packaging Soldering Chemicals Conductivity |
| Content Type | Text |
| Resource Type | Article |
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