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Content Provider | IEEE Xplore Digital Library |
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Author | Bing An Lan Ding Techun Wang Tailieh Lu Liangquan Sun Yiping Wu |
Copyright Year | 2011 |
Description | Author affiliation: School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China (Bing An; Lan Ding; Liangquan Sun; Yiping Wu) || ASE Assembly & Test (Shanghai) Limited, 669 Guoshoujing Road, Shanghai, 201203, China (Techun Wang; Tailieh Lu) |
Abstract | Due to the low cost and high mechanical and electrical properties of the copper wire as well as the environmental friendly pre-plated frame (PPF), copper wire bonding on PPF has been considered the most promising candidate to replace the gold wire bonding in actual volume production in the coming years. However, the nature of the copper, such as high hardness, sensitivity to oxidation, work hardening effect etc., coupled with the low adhesion between the copper wire and the PPF surface are the main causes to the low and unstable bonding strength, especially at the second bond. The proposed solution is to introduce a heat treatment after the PPF copper wire bonding. Two kinds of unsealed PPF copper wire bonding samples prepared under different parameters were submitted to a vacuum heat treatment at 200 °C and 10-3 Pa for 10 min. It was found that the average wire pull strengths of both samples increased. The main wire pull break modes changed after vacuum heat treatment, i.e., the second bond lift-off disappeared and the heel breaks decreased after the heat treatment. The results indicate that the heat treatment enhances the interfacial adhesion of copper wire bonding on PPF, and increases the tensile strength of the second bonds. |
Starting Page | 1 |
Ending Page | 4 |
File Size | 2146787 |
Page Count | 4 |
File Format | |
ISBN | 9781457717703 |
e-ISBN | 9781457717697 |
e-ISBN | 9781457717680 |
DOI | 10.1109/ICEPT.2011.6066860 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2011-08-08 |
Publisher Place | China |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Wires Copper Bonding Heat treatment Reliability Gold Lead |
Content Type | Text |
Resource Type | Article |
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