NDLI: Cu wire bond reliability improvement through focused heat treatment after bonding

Content Provider	IEEE Xplore Digital Library
Author	Yow Kai Yun Eu Poh Leng
Copyright Year	2008
Description	Author affiliation: Freescale Semicond. Malaysia Sdn. Bhd., Petaling Jaya, Malaysia (Yow Kai Yun; Eu Poh Leng)
Abstract	Currently, there is a great interest in applying copper material to wire bonding of fine pitch assembly packaging, particularly for cost saving purposes. However, the hardness property of copper is harder compared to the conventional gold wire. The hardness factor of copper, coupled with the work hardening effect of the USG power and force during wire bonding, is a major cause for bond pad crack and pad cratering, especially on sensitive pad devices. Known methods to soften the FAB has been evaluated and discussed. Softening the FAB has proved to play a role in decreasing the bond pad cratering. However, it does not resolve the problem completely. The proposed solution is to introduce heat after wire bonding to enhance the intermetallic adhesion strength between the copper to the Al bond pad.
Starting Page	1
Ending Page	7
File Size	326076
Page Count	7
File Format	PDF
ISBN	9781424433926
ISSN	10898190
e-ISBN	9781424433933
DOI	10.1109/IEMT.2008.5507838
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-11-04
Publisher Place	Malaysia
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Wire Heat treatment Copper Bonding forces Assembly Packaging Costs Gold Softening Intermetallic Cu Wire Cu Bonding FAB. Fine Pitch Bonding
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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