NDLI: Interfacial characteristics of Sn3.5Ag solder on copper after Nd:YAG laser surface irradiation

Content Provider	IEEE Xplore Digital Library
Author	Lei Wang Chun-qing Wang Zhen-qing Zhao Yi Huang
Copyright Year	2004
Description	Author affiliation: State Key Lab. of Adv. Welding Production Technol., Harbin Inst. of Technol., China (Lei Wang; Chun-qing Wang; Zhen-qing Zhao; Yi Huang)
Abstract	Nd:YAG laser surface irradiation of copperplate was found to affect the interfacial characteristics and wettability of SnAg eutectic solder on copperplate. Scanning electron microscopy (SEM) was used to analyze the interfacial reaction between SnAg eutectic solder and copperplate before and after laser irradiation. The microstructure changes in the surface layer of copperplate were determined using X-ray diffraction techniques; results showed that the distribution of crystal face in the surface of copperplate was changed after laser irradiation, which affected the surface energy of copperplate. The increase of surface energy reinforced the interfacial reaction and promoted the growth of intermetallics, which, however, was proved to have little impact on the morphology of intermetallics by aging.
Sponsorship	WKK Distribution Ltd. Philips Intertek Testing Services Hong Kong Ltd. Nat. Natural Sci. Found. of China Int. Conference Found. of Shanghai Jiao Tong Univ
Starting Page	202
Ending Page	205
File Size	602666
Page Count	4
File Format	PDF
ISBN	0780388062
DOI	10.1109/AGEC.2005.1452345
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-03-15
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Copper Surface emitting lasers Surface morphology X-ray lasers Scanning electron microscopy Intermetallic X-ray diffraction Crystal microstructure Laser transitions Aging
Content Type	Text
Resource Type	Article

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