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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Po-Jen Cheng Wu, W.C. Wang, W.J. Pai, T.M. |
| Copyright Year | 2015 |
| Description | Author affiliation: Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan (Po-Jen Cheng; Wu, W.C.; Wang, W.J.; Pai, T.M.) |
| Abstract | TCNCP (Thermal Compression bonding with Non Conductive Paste) was developed for fine pitch interconnection and advanced silicon node (20 nm or below) in Flip chip technology. With pre-applied NCP dispensing process, small bump joint (<;40 um) is well protected during bonding process. TCNCP provides an excellent solution for fine pitch and small interconnection. A FCCSP with fine pitch (40um) Cu pillar bump was designed in this study. 14×14 $mm^{2}$ package was assembled with $11×11mm^{2}$ die, over 3,000 bumps are connected by daisy chain between die and substrate. Flux clean was applied prior to TCNCP to remove OSP layer on top of the Cu trace. The study also investigated NCP Q (queue) time at $70^{o}C$ and $80^{o}C$ of stage temperature. To ensure a robust solder joint, solder gap (distance between Cu pillar and Cu trace) was investigated and was well controlled. Bump crack is observed at higher solder gap after reliability test (such as HTST), Sn-Cu IMC formation and Sn consumption are the failure mechanisms. Experiments show that convinced solder joint shape is found at peripheral bump, while obvious NCP entrapment is noticed at core bump. The detailed mechanism is discussed in the paper. In addition to joint quality, 2-step bonding also demonstrates 17.3% UPH enhancement as compare with normal TCNP. |
| Starting Page | 484 |
| Ending Page | 489 |
| File Size | 1523328 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781479986095 |
| DOI | 10.1109/ECTC.2015.7159635 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-05-26 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Bonding Joints Soldering Substrates Heating Reliability |
| Content Type | Text |
| Resource Type | Article |
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