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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chien-Feng Chan Wen-Tsung Tseng Huei-Nuan Huang Mu-Hsuan Chan Chun-Tang Lin Chi-Hsin Chiu |
| Copyright Year | 2011 |
| Description | Author affiliation: Siliconware Precision Industries Co., Ltd No. 153, Sec. 3, Chung-Shan Rd. Tantzu, Taichung 427, Taiwan, R.O.C. (Chien-Feng Chan; Wen-Tsung Tseng; Huei-Nuan Huang; Mu-Hsuan Chan; Chun-Tang Lin; Chi-Hsin Chiu) |
| Abstract | In order to meet the miniaturization trend and to reduce the power consumption for next generation devices, three-dimensional (3D) stacking is believed to be one of the technologies that can meet these requirements. In advanced 3D stacking technologies, one of the important steps is to develop and assembly fine pitch and high density microbumps. However, while the stacking chip size of top die and bottom die are similar, there is not enough space to dispense underfill, so it is a challenge for conventional underfill (CUF). In this paper, thermal compression bond (TCB) combine with non conductive paste (NCP) were studied. Adhesion between NCP and SiN, adhesion between NCP and PI, simulation of stress between bumps and chips were carried out and discussed. Finally, reliability test results were also reported in this paper. |
| Starting Page | 119 |
| Ending Page | 121 |
| File Size | 1245099 |
| Page Count | 3 |
| File Format | |
| ISBN | 9781457713873 |
| ISSN | 21505934 |
| e-ISBN | 9781457713897 |
| e-ISBN | 9781457713880 |
| DOI | 10.1109/IMPACT.2011.6117230 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-10-19 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Adhesives Silicon Reliability Copper Stress Vehicles |
| Content Type | Text |
| Resource Type | Article |
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