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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Gandhi, S. Markondeya Raj, P. Chou, B.C. Chakraborti, P. Kim, M.S. Sitaraman, S. Sharma, H. Sundaram, V. Tummala, R. |
| Copyright Year | 2015 |
| Description | Author affiliation: 3D Syst. Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA (Gandhi, S.; Markondeya Raj, P.; Chou, B.C.; Chakraborti, P.; Kim, M.S.; Sitaraman, S.; Sharma, H.; Sundaram, V.; Tummala, R.) |
| Abstract | This paper demonstrates 3D functional modules that are ultra-miniaturized, high-performance and low-cost, based on an innovative 3D Integrated Passive and Active Component (3D IPAC) concept [1]. The 3D IPAC concept utilizes an ultra-thin (30-100 microns) and ultra-low-loss glass substrate, low-cost through-package-vias (TPVs) and double-side redistribution layers (RDL) for assembly of both active and passive components. In this concept, both active and passive components are integrated on both sides of the glass substrate, either as thinfilms or as discretely fabricated and assembled components, separated by only about 50-100 microns in interconnection length. This paper specifically addresses the power functional modules with passive components by integrating ultra-thin high-density capacitors on one side and power-supply inductors on the other side. The first part of the paper describes the electrical modeling and design of power inductors and capacitors in 3D IPAC structure. The second section describes the fabrication for both the building block L and C components and the assembly of integrated modules. The last section presents the electrical characterization. The paper, thus, provides a first demonstration of a novel power module platform for double-side thin active and passive component integration for power module applications. |
| Starting Page | 230 |
| Ending Page | 235 |
| File Size | 2426689 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781479986095 |
| DOI | 10.1109/ECTC.2015.7159597 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-05-26 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Inductors Capacitors Three-dimensional displays Glass Substrates Inductance Multichip modules |
| Content Type | Text |
| Resource Type | Article |
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