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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Fuegl, M. Mackh, G. Meissner, E. Frey, L. |
| Copyright Year | 2015 |
| Description | Author affiliation: Fraunhofer Inst. for Integrated Syst. & Device Technol., Erlangen, Germany (Meissner, E.; Frey, L.) || Infineon Technol. AG, Regensburg, Germany (Fuegl, M.; Mackh, G.) |
| Abstract | Due to increased technological and economic requirements during wafer production several materials like metal structures or brittle low-k materials are placed within the dicing street. These materials have a negative effect on the quality and reliability results when using conventional separation methods like mechanical dicing. For this case a laser grooving step, prior mechanical dicing is used to remove these materials out of the dicing street. It is known that each of this separation method creates residual stress in the adjacent material in terms of specific strain fields. In the present study the influence of the strain fields on the mechanical and electrical behavior of chips was investigated. For this reason several laser grooving processes and a mechanical dicing process was compared using a dedicated dicing test chip with sensors to measure the electrical behavior. The mechanical fracture strength of the chips was investigated by 3-point bending tests. Photoelastic stress measurements were used to characterize resulting strain fields. The more extensive the strain fields, the lower the fracture strength, the greater the number of electrically conspicuous chips. The combination of strain field, electrical and mechanical strength characterization can help to optimize the process parameters get better reliability and quality of chips. |
| Starting Page | 214 |
| Ending Page | 219 |
| File Size | 1168271 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781479986095 |
| DOI | 10.1109/ECTC.2015.7159594 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-05-26 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Strain Sensors Lasers Measurement by laser beam Laser beams Semiconductor device measurement Stress measurement |
| Content Type | Text |
| Resource Type | Article |
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