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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jing-Ye Juang Su-Tsai Lu Su-Ching Chung Su-Mei Cheng Jong-Shiou Peng Yu-Lan Lu Pai-Cheng Chang Chia-Wen Fan Chau-Jie Zhan Tai-Hung Chen |
| Copyright Year | 2012 |
| Description | Author affiliation: Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute, No. 195, Sec. 4, Chung Hsing Rd., Chutung, Hsinchu, Taiwan 31040, R.O.C. (Jing-Ye Juang; Su-Tsai Lu; Su-Ching Chung; Su-Mei Cheng; Jong-Shiou Peng; Yu-Lan Lu; Pai-Cheng Chang; Chia-Wen Fan; Chau-Jie Zhan; Tai-Hung Chen) |
| Abstract | In this study, various micro-bump-bonded structures with TCB + NCP processes were evaluated and developed. A commercial available snap-cure NCP material was applied for the joining processes study. Three types of micro bumps, Cu/Ni/Sn2.5Ag, Cu/Sn2.5Ag and Cu/Ni/Au- were fabricated and bonded to achieve joint structures of Cu/Ni/Sn2.5Ag/Ni/Cu, Cu/Ni/Sn2.5Ag/Au/Ni/Cu and Cu/Sn2.5Ag/Au/Ni/Cu. Moreover, the filler trapped and void issues which associated with the TCB+NCP process were also investigated. After the evaluation, the reliability test such as moisture sensitivity test level 3 (MSL 3), temperature cycling test (TCT) and high temperature Storage (HTS) were conducted to the bonded samples. Hereafter, the failure modes with the mentioned issues were analyzed and discussed. Based on the experimental and reliability results, the optimized TCB + NCP processes with various micro-bump-bonded structures can be established. The joints electrical and reliability performance associated with the failure mode were investigated and analyzed. Finally, the characteristics of each joint connection were defined. |
| Starting Page | 114 |
| Ending Page | 118 |
| File Size | 2001031 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781467316354 |
| ISSN | 21505934 |
| e-ISBN | 9781467316385 |
| e-ISBN | 9781467316378 |
| DOI | 10.1109/IMPACT.2012.6420280 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-10-24 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Gold Stacking Bonding forces Nickel Reliability Joints Bonding |
| Content Type | Text |
| Resource Type | Article |
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