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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Songfang Zhao Guoping Zhang Chongnan Peng Rong Sun Lee, S.W.R. Wenhui Zhu Fangqi Lai |
| Copyright Year | 2013 |
| Description | Author affiliation: Dept. of Mech. Eng., HKUST, Hong Kong, China (Lee, S.W.R.) || Kunshan Q Technol. Ltd., Kunshan, China (Wenhui Zhu; Fangqi Lai) || Shenzhen Inst. of Adv. Technol., Shenzhen, China (Songfang Zhao; Guoping Zhang; Chongnan Peng; Rong Sun) |
| Abstract | 3D packaging using through silicon via (TSV) technology is becoming important in IC packaging industry. In this paper, the TSV process uses a polymeric liner as insulation material and a buffer for thermo-mechanical stress relaxation. Fourier transform infrared spectroscopy (FTIR), thermogravimetry analysis (TGA), differential scanning calorimetry (DSC), dielectric and contact angle tests are applied to select a suitable dielectric from two kinds of polymers. All the properties show that the linear o-crosel phenolic (LOPF) is suitable for acting as an insulation liner in the TSV process. Then the LOPF liquid is spun on the wafer, followed by soft baking at the temperature of 115 °C, the processed wafer is inspected using optical microscope, step profiler and scanning electron microscope (SEM). All the results indicate that LOPF has good potential to be the insulation layers for TSV. |
| Sponsorship | IEEE Components, Packaging Manuf. Technol. Soc. |
| Starting Page | 81 |
| Ending Page | 85 |
| File Size | 1359243 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781479902330 |
| ISSN | 05695503 |
| e-ISBN | 9781479902323 |
| DOI | 10.1109/ECTC.2013.6575554 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-05-28 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Insulation Through-silicon vias Plastics Silicon Dielectrics Thermal stability Liquids |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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