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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chakraborti, P. Sharma, H. Raj, P.M. Tummala, R. |
| Copyright Year | 2013 |
| Description | Author affiliation: 3D Syst. Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA (Chakraborti, P.; Sharma, H.; Raj, P.M.; Tummala, R.) |
| Abstract | This paper presents a novel set of low-cost materials and processes to fabricate thinfilm decoupling capacitors on silicon and glass substrates, using printed valve-metal electrodes. The valve-metals such as Al and Ta allow for easy formation of conformal, robust and high insulation-strength dielectrics. By utilizing self-healing counter electrodes, high yield with low leakage currents were demonstrated. Such a thinfilm capacitor processing is compatible with large-area, high through-put glass substrates with through-vias. The process, therefore, allows double-side passive or active component integration in ultrathin substrates, leading to a unique and novel passive and active component integration technology referred to as 3D IPAC (3-Dimensional Integrated Actives and Passive components) for miniaturized and complete power or RF modules. |
| Sponsorship | IEEE Components, Packaging Manuf. Technol. Soc. |
| Starting Page | 1043 |
| Ending Page | 1047 |
| File Size | 830471 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781479902330 |
| ISSN | 05695503 |
| e-ISBN | 9781479902323 |
| DOI | 10.1109/ECTC.2013.6575701 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-05-28 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Electrodes Capacitors Aluminum Silicon Radiation detectors Substrates |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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