Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yong Liu Qiuxiao Qian Byoungok Lee Taekkeun Lee Joonseo Son Oseob Jeon |
| Copyright Year | 2013 |
| Description | Author affiliation: Fairchild Semicond. Corp, Portland, ME, USA (Yong Liu; Qiuxiao Qian; Byoungok Lee; Taekkeun Lee; Joonseo Son; Oseob Jeon) |
| Abstract | In this paper, an automotive power module (APM) package is considered with multiple die including MOSFETs, passive components, shunt resistor and thermistor attached on the direct bonded copper (DBC) substrate. 3D finite element models for design and assembly process are generated in order to conduct the DoE numerical simulations for each design and assembly process. In design phase, both electrical and thermal simulations are carried out to improve the electrical and thermal performance. The electrical resistance and inductance are examined in order to minimize the package effects on Rds(on) and switching noise. Thermal characterization is conducted for the APM heat dissipation design evaluation. In assembly manufacturing process, molding is a very critical process to ensure the high reliability of the APM product. Molding simulation is discussed to check the flow front, gate design option and the possible voids track. The mechanical simulation is also conducted to check the warpages and stresses after molding and the APM mounting process to see if package cracking, or delamination might occur in these assembly processes. Modeling is conducted to determine the proper clamping force for low clearance and avoid high stress in ceramic. |
| Sponsorship | IEEE Components, Packaging Manuf. Technol. Soc. |
| Starting Page | 2144 |
| Ending Page | 2150 |
| File Size | 873728 |
| Page Count | 7 |
| File Format | |
| ISBN | 9781479902330 |
| ISSN | 05695503 |
| e-ISBN | 9781479902323 |
| DOI | 10.1109/ECTC.2013.6575877 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-05-28 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Heat sinks Assembly Clamps Logic gates Atmospheric modeling Integrated circuit modeling Solid modeling |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|