Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yuan-Yun Wu Lee, C.C. |
| Copyright Year | 2013 |
| Description | Author affiliation: Electr. Eng. & Comput. Sci., Mater. & Manuf. Technol., Univ. of California, Irvine, Irvine, CA, USA (Yuan-Yun Wu; Lee, C.C.) |
| Abstract | Over the past several years, we have developed several fluxless bonding processes using the silver-indium (Ag-In) system. With innovative design, the joint achieves high melting temperature, higher than 600°C, even when the bonding is performed at low temperature, 180°C. The joint has the structure of $Ag/(Ag)/Ag_{2}In/(Ag)/Ag$ where (Ag) is the solid solution of Ag with In. Shear test results show that $Ag_{2}In$ is the weak region in the structure. To increase the joint strength, an idea is to convert $Ag_{2}In$ compound into (Ag) by continuous reaction with the adjacent (Ag) regions. When this happens, the melting temperature of the joint will increase to 790°C. In this research, we studied this converting process with systematic experiments. The joint is made between two copper (Cu) substrates to ensure that the samples break in the joint rather than in the substrate during shear test. The upper Cu was electroplated with 15μm thick Ag layer. The lower Cu was electroplated with 15μm thick Ag layer, followed by 8μm indium, which was the capped by 0.1μm Ag layer to avoid In oxidation. The samples were bonded at 180°C in 100 millitorr for 5 minutes. SEM & EDX analysis show that the joint has structure of $Ag/(Ag)/Ag_{2}In/(Ag)/Ag,$ where the $Ag_{2}In$ region is 15μm. Samples are well bonded between Cu substrates without crack or voids. To convert $Ag_{2}In$ region into (Ag), samples were annealed at 200°C for 200, 300, 500 hours, respectively. 200°C was chosen because it is more compatible with the surviving temperature of most devices. The samples were cut in cross section, polished, and examined using scanning electron microscopy (SEM) with energy dispersive X-ray spectroscopy (EDX) to study its microstructure and composition. At 200 hours, the sample is still well bonded. The joint turned into Ag/(Ag)/alloy/(Ag)/Ag, where alloy is a mixture of $Ag_{2}In$ and $Ag_{3}In$ compounds. At 300 hours, the joint structure has not changed but the alloy region becomes thinner. At 500 hours, the alloy region is almost gone. The annealing process continues. After the alloy region turns into (Ag), six samples will go through shear test. Shear strength will be measured and fracture mode identified. We expect the (Ag) phase to be significantly stronger than the $Ag_{2}In$ compound. This bonding and annealing processes thus provide a new way to produce strong and high-temperature joints at low temperature, 200°C. |
| Sponsorship | IEEE Components, Packaging Manuf. Technol. Soc. |
| Starting Page | 1783 |
| Ending Page | 1787 |
| File Size | 794285 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781479902330 |
| ISSN | 05695503 |
| e-ISBN | 9781479902323 |
| DOI | 10.1109/ECTC.2013.6575817 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-05-28 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Joints Annealing Scanning electron microscopy Substrates Bonding Metals |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|