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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kopp, C. Bernabe, S. Philippe, P. |
| Copyright Year | 2009 |
| Description | Author affiliation: CEA, LETI , MINATEC, 17, rue des martyrs, 38054 Grenoble, France (Kopp, C.; Bernabe, S.; Philippe, P.) |
| Abstract | Packaging of optolelectronic devices has always been a bottleneck for mass production. Today, it is still the case for Silicon Photonics Devices. Intrinsically, the technology of silicon nanowires integrated onto SOI electronic integrated circuits allows the same kind of cost reduction as the one encountered in the microelectronic industry. However, smart solutions have to be proposed in order not to lose this benefit because of the use of non suitable packaging architectures. |
| Starting Page | 1914 |
| Ending Page | 1919 |
| File Size | 1198720 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424444755 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2009.5074281 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-05-26 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Optical devices Silicon Photonics Integrated circuit technology Electronics packaging Integrated circuit packaging Mass production Costs Optical fibers Optoelectronic devices |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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