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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Tzu-Ying Kuo Ying-Ching Shih Yuan-Chang Lee Hsiang-Hung Chang Zhi-Cheng Hsiao Chia-Wen Chiang Shu-Man Li Yu-Jiau Hwang Cheng-Ta Ko Yu-Hua Chen |
| Copyright Year | 2009 |
| Description | Author affiliation: Industrial Technology Research Institute (ITRI), Electronics and Optoelectronics Research Laboratories (EOL), R100, Bldg. 17, 195, Sec. 4, Chung Hsing Rd. Chutung, Hsinchu, Taiwan 310, R.O.C (Tzu-Ying Kuo; Ying-Ching Shih; Yuan-Chang Lee; Hsiang-Hung Chang; Zhi-Cheng Hsiao; Chia-Wen Chiang; Shu-Man Li; Yu-Jiau Hwang; Cheng-Ta Ko; Yu-Hua Chen) |
| Abstract | An ultra-thin, flexible package was successfully demonstrated in this paper. The integration of semiconductor chip and flexible substrate, development of ultra-thin chip technology, and embedded chip technology are the key topics. For the purpose of bendable, the embedded chip should be thin enough. The chips were thinned to less than 20µm by mechanical grinding and plasma treatment process. Besides, the dicing before grinding (DBG) method was applied for segment of ultra-thin chips. The ultra-thin chip can be embedded into a thin polyimide material by lamination process and build-up layer coating without die attached film (DAF). Following, micro-via drilling process, metallization and patterning process realize electrical interconnections. A temporary rigid carrier substrate was used for handling ultrathin substrate during process. Finally, an ultra-thin, flexible package was accomplished by releasing from the carrier substrate. Using this novel process, the total thickness of flexible package is only 59µm. It can be easily bended, and the curvature radius of flexible package can reach 10mm without any cracks occurred. The static and dynamic bending tests were also done. The results show this ultra-thin and flexible package has good mechanical properties. Technologies and bending test results will be represented in this paper. |
| Starting Page | 1749 |
| Ending Page | 1753 |
| File Size | 1285374 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424444755 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2009.5074252 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-05-26 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Substrates Semiconductor device packaging Testing Plasma applications Plasma materials processing Polyimides Lamination Coatings Drilling Metallization |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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