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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Soojae Park Feger, C. |
| Copyright Year | 2009 |
| Description | Author affiliation: T.J. Watson Research Center, IBM, 1101 Kitchawan RD., Route 134/PO Box 218, Yorktown Heights, NY 10598, USA (Soojae Park; Feger, C.) |
| Abstract | Failure of organic packages is often accelerated by mechanical failure of an underfill designed to protect the solder joints. The crack growth rate of an underfill under thermal cycling is crucial for package reliability and lifetime prediction. Mechanically-induced fatigue crack growth results have been used in package reliability studies, but thermally-induced fatigue crack growth data for underfills does not exist. Thermal fatigue experiments are complex to perform, since it is thermal loading that grows underfill cracks in actual packages. We describe the fatigue crack growth behaviors of an underfill measured by applying thermal fatigue stresses to obtain low-cycle fatigue da/dN vs. thermal stress intensity factor plots. The number of cycles to failure or fast fracture was found to depend strongly on thermal loading. We compared thermal fatigue data with thermal fracture toughness results, and found that the final crack length after thermal fatigue crack growth compared well with the critical crack length of thermal fracture data. |
| Starting Page | 1240 |
| Ending Page | 1244 |
| File Size | 433603 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424444755 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2009.5074170 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-05-26 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Fatigue Thermal stresses Electronic packaging thermal management Viscosity Elasticity Temperature distribution Soldering Thermal loading Thermal factors Testing |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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