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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Zhiyong Xiao Yang Chai Chan, P.C.H. Baoqin Chen Min Zhao Ming Liu |
| Copyright Year | 2009 |
| Description | Author affiliation: Institute of Microelectronics of Chinese Academy of Science, Chaoyang District, Beijing, China (Baoqin Chen; Min Zhao; Ming Liu) || Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, SAR, China (Zhiyong Xiao; Yang Chai; Chan, P.C.H.) |
| Abstract | Single-walled (SW) and multi-walled (MW) carbon nanotubes (CNTs) have excellent electrical, mechanical and thermal properties. They are considered as promising materials for future interconnect applications. MWCNTs are concentric rolls of graphene sheets. As-grown MWCNTs are typically close-ended, so the inner shells cannot be contacted to the metal electrodes and have limited contribution to the electrical conductance. Open-ended MWCNTs are preferred for interconnect applications to meet the conductance requirement. In this paper, a simple sacrificial process was developed to truncate CNTs. CNT vias were fabricated and a sacrificial process was employed to remove the CNT caps. Resistance of vias with open-ended and close-ended MWCNTs was measured using two-terminal voltage-current measurement. Via conductance was significantly increased after the MWCNTs in the vias were truncated to be open-ended using the sacrificial process. |
| Starting Page | 1811 |
| Ending Page | 1815 |
| File Size | 3986611 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424444755 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2009.5074264 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-05-26 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Carbon nanotubes Electrodes Conducting materials Lithography Contacts Electrical resistance measurement Copper Dielectric substrates Iron Fabrication |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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