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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Feng Gao Qu, J. Takemoto, T. |
| Copyright Year | 2009 |
| Description | Author affiliation: Georgia Institute of Technology, 801 Ferst Drive NW, Atlanta, GA 30332-0405, USA (Feng Gao; Qu, J.) || Joining and Welding Research Institute, Osaka University, 11-1 Mihogaoka, Ibaraki-shi, 567-0047, Japan (Takemoto, T.) |
| Abstract | The Cu6Sn5 intermetallic compound is generated at the interface between OSP substrate and Sn-3.5Ag based solder containing small amount of Co or Ni additives. A small fraction of Co or Ni additive is probed in Cu6Sn5-based crystal structure, which occupies the crystal space sites of Cu atoms. The first-principle approach within the density functional theory is employed herein to explore the favorite sites of Ni and Co atoms in Cu6Sn5-based intermetallic compound. In the additive concentration regime of 0.0∓18.2 at.%, the Ni atoms occupancy leads to a more thermodynamically stable (Cu, Ni)6Sn5 phase, while the Co atom occupancy results in a less stable phase, regardless of the occupancy sites. The density of states (DOS) analysis indicates that the Co occupancy in (Cu, Co)6Sn5 also leads to a less stable electronic structure. Basically, the Ni occupancy in (Cu, Ni)6Sn5 phase enhances the electronic structure stabilization. At the low Ni concentration level (9.1 at.% in Cu5Ni1Sn5 phase), the Ni atoms prefers to occupy 4a Cu atom site; while the Ni atoms will be located at 8f2 Cu atom site at the high concentration level (18.2 at.% in Cu4Ni2Sn5 phase). |
| Starting Page | 1014 |
| Ending Page | 1020 |
| File Size | 2940363 |
| Page Count | 7 |
| File Format | |
| ISBN | 9781424444755 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2009.5074136 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-05-26 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Additives Lead Intermetallic Crystal microstructure Electrons Environmentally friendly manufacturing techniques Density functional theory Soldering Thermodynamics Welding |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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