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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Gain, A.K. Chan, Y.C. Sharif, A. Yung, W.K.C. |
| Copyright Year | 2009 |
| Description | Author affiliation: Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong (Yung, W.K.C.) || Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong (Gain, A.K.; Chan, Y.C.; Sharif, A.) |
| Abstract | Sn-8Zn-3Bi solder balls with different weight percentages of Sn-Ag-Cu addition were bonded to Au/Ni metallized Cu pads, and the effect of multiple reflow and aging on impact reliability was investigated. In the Sn-Ag-Cu content Sn-Zn-Bi solder joints, the AgZn3 intermetallic compound layer was clearly observed at the interfaces and its thickness increased with an increase the number of reflow cycles and aging time. In the solder ball region, fine acicular-shaped Zn-rich phase and spherical-shaped AgZn3 compound particles were found in ß-Sn matrix. The shear strength of monolithic Sn-Zn-Bi and 7wt% Sn-Ag-Cu content Sn-Zn-Bi solder joints after one reflow cycle were about 44.5MPa and 53.1MPa, respectively while their shear strengths after eight reflow cycles were about 43.4MPa and 51.6MPa, respectively. The fracture surface of monolithic Sn-Zn-Bi solder exhibited a semi ductile fracture mode with a smooth surface while Sn-Zn-Bi solder joints containing Sn-Ag-Cu particles showed a typical ductile failure with very rough dimpled surfaces. |
| Starting Page | 1021 |
| Ending Page | 1026 |
| File Size | 1383167 |
| Page Count | 6 |
| File Format | |
| ISBN | 9781424444755 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2009.5074137 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-05-26 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Soldering Environmentally friendly manufacturing techniques Lead Electronics packaging Oxidation Electronics industry Rough surfaces Surface roughness Surface cracks Microelectronics |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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