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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Yong Liu Qian, R. Quinones, C. Irving, S. Luk, T. |
| Copyright Year | 2009 |
| Description | Author affiliation: Fairchild Semiconductor Corp, 82 Running Hill Road, Mail Stop 35-2E, South Portland, ME 04106, USA (Yong Liu; Qian, R.; Quinones, C.; Irving, S.; Luk, T.) |
| Abstract | This paper investigates the manufacturing variation in an Opto-BGA system in package (SIP) and its impact to the reliability and quality. Both the 3D finite element analysis (FEA) modeling and the reliability TMCL test on the opto-BGA manufacturing variation are studied. In the FEA model, the hyper-elastic behavior of the opto-coupling material is considered. In the reliability test, the samples are made in two groups, one is the typical case and the other is the worst case manufacturing variation in which the bond wire loop goes beyond the opto-coupling dome into the outer glob top coat layer. The modeling results show that in the typical design case, the die stress is too small to damage the opto-BGA. The peel stress in die attach is also very small. While in the worst case, the die stress is ten times greater than the typical case. The peel stress in die attach is much higher than the typical case when temperature increase to 125C. From the result of TMCL reliability test, actual test data is found to correlate in failure location and mechanism with the modeling/simulation, for both typical and worst case manufacturing variation. |
| Starting Page | 196 |
| Ending Page | 200 |
| File Size | 1805823 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424444755 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2009.5074016 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-05-26 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Packaging Testing Stress Virtual manufacturing Microassembly Pulp manufacturing Finite element methods Bonding Wire Temperature |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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