Please wait, while we are loading the content...
| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Farley, D. Kahnert, T. Sinha, K. Solares, S. Dasgupta, A. Caers, J.F.J. Zhao, X.J. |
| Copyright Year | 2009 |
| Description | Author affiliation: Philips Applied Technologies, Electronic Packaging & Thin Film, Eindhoven, the Netherlands (Caers, J.F.J.; Zhao, X.J.) || CALCE Electronic Products and Systems Consortium, 2181 Martin Hall, Mechanical Engineering Department, University of Maryland, College Park, 20742, USA (Farley, D.; Kahnert, T.; Sinha, K.; Solares, S.; Dasgupta, A.) |
| Abstract | In the conversion to Pb-free electronics, there has been increasing interest in conductive adhesive interconnects, as they combine Pb-free materials with the added benefit of low temperature, processing [1]. This paper explores the the degradation mechanisms and kinetics in adhesively bonded Au-bumped flip chip interconnects. Earlier researchers have suggested that electrical contact is by mechanical interfacial pressure and that stress relaxation of the adhesive material is a major degradation mechanism, since temperature cycling and moisture cycling throughout the life cycle can progressively lower the contact pressure between the contacting parts, resulting in progressive cyclic increase in contact resistance. However, temperature cycling conducted by this group raised questions about the validity of this hypothesis since no such progressive degradation was found under temperature cycling, but overstress failures were found instead at cold temperatures [2]. The alternate bonding mechanism suggested by this study was metallurgical bonding between the Au bumps by cold-welding In the present paper, experimental results and modeling results showing evidence of this cold welding phenomenon are presented. These results are somewhat novel, as prior examples of low-temperature cold welding are mostly for very thin gold films [3]. The surface roughness of unmated and mated Au bumps is characterized on flip-chip dies, since the amount of surface flattening provides insights into both mechanical interlocking as well as propensity for cold-welding [4]. Using techniques developed in related studies [5], elastic-plastic, large-deformation finite element modeling with nonlinear contact surfaces is used to further understand and quantify this surface-flattening phenomenon. The consequences that these bonding mechanisms have on the robustness of the adhesive interconnect and how this affects the failure modeling approach are discussed. |
| Starting Page | 67 |
| Ending Page | 73 |
| File Size | 1887858 |
| Page Count | 7 |
| File Format | |
| ISBN | 9781424444755 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2009.5073998 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-05-26 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Welding Robustness Bonding Temperature Degradation Contacts Gold Conducting materials Rough surfaces Surface roughness |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
National Digital Library of India (NDLI) is a virtual repository of learning resources which is not just a repository with search/browse facilities but provides a host of services for the learner community. It is sponsored and mentored by Ministry of Education, Government of India, through its National Mission on Education through Information and Communication Technology (NMEICT). Filtered and federated searching is employed to facilitate focused searching so that learners can find the right resource with least effort and in minimum time. NDLI provides user group-specific services such as Examination Preparatory for School and College students and job aspirants. Services for Researchers and general learners are also provided. NDLI is designed to hold content of any language and provides interface support for 10 most widely used Indian languages. It is built to provide support for all academic levels including researchers and life-long learners, all disciplines, all popular forms of access devices and differently-abled learners. It is designed to enable people to learn and prepare from best practices from all over the world and to facilitate researchers to perform inter-linked exploration from multiple sources. It is developed, operated and maintained from Indian Institute of Technology Kharagpur.
Learn more about this project from here.
NDLI is a conglomeration of freely available or institutionally contributed or donated or publisher managed contents. Almost all these contents are hosted and accessed from respective sources. The responsibility for authenticity, relevance, completeness, accuracy, reliability and suitability of these contents rests with the respective organization and NDLI has no responsibility or liability for these. Every effort is made to keep the NDLI portal up and running smoothly unless there are some unavoidable technical issues.
Ministry of Education, through its National Mission on Education through Information and Communication Technology (NMEICT), has sponsored and funded the National Digital Library of India (NDLI) project.
| Sl. | Authority | Responsibilities | Communication Details |
|---|---|---|---|
| 1 | Ministry of Education (GoI), Department of Higher Education |
Sanctioning Authority | https://www.education.gov.in/ict-initiatives |
| 2 | Indian Institute of Technology Kharagpur | Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project | https://www.iitkgp.ac.in |
| 3 | National Digital Library of India Office, Indian Institute of Technology Kharagpur | The administrative and infrastructural headquarters of the project | Dr. B. Sutradhar bsutra@ndl.gov.in |
| 4 | Project PI / Joint PI | Principal Investigator and Joint Principal Investigators of the project |
Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon |
| 5 | Website/Portal (Helpdesk) | Queries regarding NDLI and its services | support@ndl.gov.in |
| 6 | Contents and Copyright Issues | Queries related to content curation and copyright issues | content@ndl.gov.in |
| 7 | National Digital Library of India Club (NDLI Club) | Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach | clubsupport@ndl.gov.in |
| 8 | Digital Preservation Centre (DPC) | Assistance with digitizing and archiving copyright-free printed books | dpc@ndl.gov.in |
| 9 | IDR Setup or Support | Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops | idr@ndl.gov.in |
|
Loading...
|