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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Haojun Zhang Seungbae Park |
| Copyright Year | 2009 |
| Description | Author affiliation: Department of Mechanical Engineering, Binghamton University, Vestal, NY 13850, USA (Haojun Zhang; Seungbae Park) |
| Abstract | Moisture that penetrates into the electronic package causes catastrophic crack propagation during reflow process, known as “pop-corning”. The void at interface between encapsulant and other non-polymeric components such as metal lead frame plays an important role in crack initiation and propagation. As packages experience high temperature over 240°C during reflow process, the pressure inside the void rises significantly. Kitano et al [1] found the pressure to be close to the saturated vapor pressure. This pressure on void walls make the initial crack to grow rapidly during reflow process [2]. It was conjectured that there is some amount of water inside voids and vaporizes during reflow process. The entrapment of water within the package interface void has been a persistent research theme. Several known possible mechanisms of moisture ingress into and outgassing from the void were investigated and summarized by Jang et al [3]. In his paper, he proposed that quick moisture diffusion at high reflow temperature can result in high vapor pressure inside voids and the vapor pressure could rise up to its maximum within tens of seconds, which is short enough to be within the reflow profile. In this paper, a special experiment fixture was designed and used to support his conclusions In addition to experiments, 3D finite element models were used to analyze the experimental results. |
| Starting Page | 1393 |
| Ending Page | 1396 |
| File Size | 1236737 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424444755 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.2009.5074194 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-05-26 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Plastic packaging Moisture Electronics packaging Temperature Humidity Lead Fixtures Finite element methods Mechanical engineering Semiconductor device modeling void moisture diffusion electronic package water ingress |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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