NDLI: Thermal characterisation of electrically conductive adhesive flip-chip joints

Content Provider	IEEE Xplore Digital Library
Author	Sihlbom, A. Liu, J.
Copyright Year	1998
Description	Author affiliation: Inst. of Production Eng. Res., Molndal, Sweden (Sihlbom, A.)
Abstract	In this paper, we present simulation results of the thermal characteristics of epoxy-based anisotropically conductive adhesive (ACA) flip-chip joints. The results are compared with the thermal characteristics of isotropically conductive adhesive (ICA) flip-chip joints, soldered flip-chip modules and wire bonded modules. The simulated thermal parameters are the overall thermal resistance from the active chip surface down to the substrate as well as the unsteady/transient state characteristics time constant. In modern telecommunication applications, the thermal behaviour (temperature response) caused by electronic high power pulses are of great interest. The unsteady state characteristics are discussed and presented as time constants under different conditions. The thermal simulation software used is an IVF-developed software designed for electronic packaging applications. In order to study the effect of different ACA joint shapes on the thermal characteristics, a joint thermal crack model was developed and simulated for various sets of parameters. The purpose of the investigation of a nonperfect ACA joint is to see how thermal characteristics are affected by ACA joint shape. Simulation of isotropically electrically conductive adhesive joints was done for 35 /spl mu/m thick joints. Simulations were made for two different bondline thicknesses for soldered flip-chip modules. Finally, simulations have been done on a wire bonded module and on an ideally contacted ACA mounted flip-chip module with 400 I/Os in order to compare the two cases.
Starting Page	251
Ending Page	257
File Size	803139
Page Count	7
File Format	PDF
ISBN	078035141X
DOI	10.1109/EPTC.1998.756011
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-12-10
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal conductivity Conductive adhesives Electronic packaging thermal management Bonding Thermal resistance Wire Surface resistance Application software Shape Anisotropic magnetoresistance
Content Type	Text
Resource Type	Article

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