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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Xi Chen Anmin Hu Ming Li Hong Shen Dali Mao |
| Copyright Year | 2007 |
| Description | Author affiliation: Shanghai Jiao Tong Univ., Shanghai (Xi Chen; Anmin Hu; Ming Li; Hong Shen; Dali Mao) |
| Abstract | Influence of surface electroplated pure copper on oxidation failure of lead frame copper alloys for IC package were investigate. Pure copper layer will benefit the diffusion of copper ion, so the thickness of copper oxide films increase but the velocity of CuO formation decrease and the oxidation only occurs at pure copper layer. As electroplating pure copper layer on copper alloy exceed a critical thickness, surface electroplating treatment can improve copper alloy's resistance against oxidation failure greatly. The oxide film structure of copper alloys is $CuO/Cu_{2}O/Cu$ substrate, after electroplate treated, and the oxide film structure change to CuO (no or $trace)/Cu_{2}O/Cu.$ The oxide films with only $Cu_{2}O$ have higher adhesion strengths. |
| Starting Page | 1 |
| Ending Page | 5 |
| File Size | 1870003 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424413911 |
| DOI | 10.1109/ICEPT.2007.4441545 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-08-14 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Oxidation Copper alloys Surface resistance Lead compounds Coatings Semiconductor films Adhesives Semiconductor device packaging Temperature Materials science and technology |
| Content Type | Text |
| Resource Type | Article |
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