NDLI: Investigate influence of solder thickness on the fatigue failure behavior of solder joint under high temperature

Content Provider	IEEE Xplore Digital Library
Author	Zhu, Yongxin Li, Xiaoyan Gao, Ruiting Wang, Chao
Copyright Year	2014
Description	Author affiliation: School of Materials Science and Engineering, Beijing University of Technology, Beijing, China (Zhu, Yongxin; Li, Xiaoyan; Gao, Ruiting; Wang, Chao)
Abstract	Solder joint thickness has an important effect on the fatigue failure behavior of solder joint. In this study, fatigue behavior of solder joints with different solder thickness (0.1mm, 0.2mm, 0.3mm) were studied under 398K. The failure path and rupture morphology were observed utilizing scanning electron microscopy (SEM) in order to reveal the failure mechanism. Moreover, fatigue life was evaluated using the Coffin-Masson model and the influence of solder thickness on the fatigue exponent and coefficient was analyzed. The result shows that fatigue life of solder joint increases with the solder thickness. Solder joins of lowest thickness has the fast maximum load drop rate. Besides, the fatigue ductility exponent in Coffin-Masson model decrease with the solder thickness, so, the higher solder thickness means super fatigue resistance. On the other hand, fatigue crack is initiated at the corner of the solder joint, and propagated in the solder matrix with a direction paralleling to the loading direction. A deformation concentrated zone along the diagonal of solder joint is formed with increasing the solder thickness, inducing a step-like fracture morphology and all samples show a ductility rupture mode.
Starting Page	940
Ending Page	944
File Size	484697
Page Count	5
File Format	PDF
ISBN	9781479938605
DOI	10.1109/ISAF.2014.6918011
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fatigue Soldering Strain Morphology Stress Lead Joints high temperature solder joint thickness fatigue failure fatigue life
Content Type	Text
Resource Type	Article

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