NDLI: Study of microstructure evolution and temperature distribution in eutectic SnBi solder joints under high current density

Content Provider	IEEE Xplore Digital Library
Author	Liu, Qian Shu, Yutian Ma, Limin Guo, Fu
Copyright Year	2014
Description	Author affiliation: The College of Materials Science and Engineering, Beijing University of Technology, 100 Ping Le Yuan, Chaoyang District, Beijing 100124, P. R. China (Liu, Qian; Shu, Yutian; Ma, Limin; Guo, Fu)
Abstract	Microstructure evolution and temperature distribution of eutectic SnBi solder joint under high current density of $1×10^{4}A/cm^{2}$ at room temperature were investigated in the current study. With the increase of current stressing time, a continuous Bi segregation layer was formed and grew along the interface at the anode side, and a Sn rich region was found at the cathode side. Due to the microstructure changes in solder alloys, temperature distribution tended to be nonuniform. Because of the aggregation of Bi atoms, which have higher electrical resistivity and lower thermal conductivity, at the anode side, the temperature of anode was higher than the cathode. Due to the formation of severe cracks in the solder joints, the local Joule Heating effect was enhanced and the local temperature was much higher. It was found that the microstructure evolution induced by electromigration (EM) could alter the temperature distribution. By using the infrared microscope to record temperature in the solder joint during current stressing, the relationship was established between microstructural changes and temperature filed in the SnBi joint under high current density.
Starting Page	907
Ending Page	911
File Size	665269
Page Count	5
File Format	PDF
ISBN	9781479938605
DOI	10.1109/ISAF.2014.6918004
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Microstructure Temperature distribution Anodes Current density Bismuth Materials Joule Heating effect electromigration temperature distribution microstructure evolution eutectic SnBi
Content Type	Text
Resource Type	Article

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