NDLI: Drop-on-demand jetting of piezoelectric diaphragm-piston for fabricating precision solder bumps

Content Provider	IEEE Xplore Digital Library
Author	He, Long Wei, Xingfang Zhang, Honghai Chen, Peng Luo, Hao Ma, Ming Liu, Sheng Shu, Xiayun
Copyright Year	2014
Description	Author affiliation: Division of MOEMS, Wuhan National Laboratory for Optoelectronics, School of Mechanical Science and Engineering, Huazhong University of Science & Technology, Wuhan China (He, Long; Wei, Xingfang; Zhang, Honghai; Chen, Peng; Luo, Hao; Ma, Ming; Liu, Sheng; Shu, Xiayun)
Abstract	Aiming at producing highly uniform ultra-small solder bumps to meet the growing requirements in the area array package, a novel fabrication method based on piezoelectric diaphragm-piston droplet jetting was proposed. The principle and customized equipment of this method were introduced. Solder bumps with a diameter less than 100 mm were successfully fabricated with the customized equipment. The main control parameters, such as voltage amplitude, pulse duration and the nozzle diameter, were studied to investigate their impact on the diameter of the solder bumps. The experimental results show that, while the voltage amplitude of the piezoelectric ceramic is within the range of 31 V∼34 V and the pulse duration is within the range of 0.3 ms∼0.5 ms, the device can perform stable single droplet jetting, and the droplets diameter will increase as the nozzle diameter becomes larger.
Starting Page	10
Ending Page	13
File Size	492763
Page Count	4
File Format	PDF
ISBN	9781479938605
DOI	10.1109/ISAF.2014.6917802
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Pistons Ceramics Arrays Liquids Educational institutions piezoelectric diaphragm-piston area array package solder bumps drop-on-demand jetting
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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