NDLI: Reliability of BGA assembled with lead-free low melting and medium melting mixed solder alloys

Content Provider	IEEE Xplore Digital Library
Author	Liu, Yan Keck, Joanna Page, Erin Lee, Ning-Cheng
Copyright Year	2014
Description	Author affiliation: Indium Corporation, Clinton, NY (Liu, Yan; Keck, Joanna; Page, Erin; Lee, Ning-Cheng)
Abstract	Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study, BGAs with SAC105, SAC305, and BiSnAg balls were assembled with SAC105, SAC305 or 57Bi42Sn1Ag solder paste. Joint mechanical strength, drop test performance, and voiding performance were evaluated against the reflow profile. SnPb was included as a control. The findings are as follows: (1) The microstructure of solder joints showed that, among all of the combinations, only BiSnAg-105 LT and BiSnAg-305 LT exhibited well-distinguishable alloy regions. For SAC-BiSnAg systems, Sn-dendrites were noticeable at LT, while Ag3Sn needles developed at HT. The joints were homogeneous for the rest of the combinations. (2) In the shear test, combinations involving BiSnAg solder were brittle, regardless of the Bi alloy location and reflow profile, as evidenced by stress-strain curves and morphology of the ruptured surface. The strong influence of Bi on the rupture site may have been caused by the stiffening effect of solder due to the homogenized presence of Bi in the joint. With the stiffened solder, the brittle IMC interface became the weakest link upon shearing, although the brittle BiSn crystalline structure also contributed to the rupture. (3) In the drop test, all Bi-containing solder joints performed poorly compared with Bi-free systems, which was consistent with shear test results. Drop numbers increased with increasing elongation at break of solder bumps as measured in the shear test. (4) Voiding was affected by flux chemistry and reduced by low alloy homogenization temperatures and solid top factors, but was increased by low surface tension factor, melting sequence factor, overheating factor and wide pasty range factor. Compared to SAC or SnPb systems, the BiSnAg system is low in voiding if reflowed at LT. In this study, voiding had an insignificant effect on shear strength and drop test performance.
Starting Page	1083
Ending Page	1095
File Size	2401161
Page Count	13
File Format	PDF
ISBN	9781479938605
DOI	10.1109/ISAF.2014.6918043
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-05-12
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Metals Temperature Solids Joints Soldering Substrates Surface tension lead-free Low melting 57Bi42Sn1Ag SAC105 SAC305 BGA assembly soldering voiding drop test reliability mixed alloys
Content Type	Text
Resource Type	Article

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